Hynix

Nov. 4 (Bloomberg) -- NVIDIA CEO Jen-Hsun Huang has asked SK Hynix to supply next-generation, high-bandwidth memory chips known as HBM4 six months ahead of schedule, SK Group Chairman Choi Tae-won said, according to a Reuters report today. SK Hynix plans to launch the first HBM4 products with 12-layer DRAM stacks in the second half of 2025, with 16-layer stacked HBMs launching slightly later in 2026. SK Hynix and TSMC signed a Memorandum of Understanding (MOU) in April this year, announcing that they will collaborate on HBM in...

According to reports from Korean media Chosun Ilbo and ZDNET Korea, Park Kyung, president of SK Hynix's system architecture, said at an academic seminar held yesterday in South Korea that storage products have transformed from simple components to solutions in the AI era. Park Kyung said: "It is not enough to just have DRAM design skills. We need to look at how the system is changing, and what opportunities and challenges exist, from the perspective of "operations and systems," not just from the perspective of semiconductor technology. The semiconductor ecosystem used to be dominated by supply and demand, but it has not...

The world's No. 2 memory chip maker -- SK Hynix -- said it plans to spend $3.87 billion (currently about Rs. 28.058 billion) to build an advanced packaging plant and an artificial intelligence product research center in Indiana, Bloomberg reported. SK Hynix plans to build its first facility in West Lafayette, US, and is scheduled to begin mass production in the second half of 2028. The plant will focus on building a production line for next-generation high-bandwidth memory chips, which are key components for training graphics processors for artificial intelligence (AI) systems. As the primary design of the HBM chips...