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  • Semron raises $7.9 million for 3D-packaged AI chips for mobile devices, 20 times more efficient

    Semron raises $7.9 million for 3D-packaged AI chips for mobile devices, 20 times more efficient

    German company Semron recently successfully raised $7.9 million (7.3 million euros) to promote the efficiency of AI chips on mobile devices through advanced 3D packaging technology. Dresden-based Semron said their goal is to set new standards for AI chips on mobile devices to meet the evolving needs of the industry. Source note: Image generated by AI, image licensing service provider Midjourney The financing was led by Join Capital and supported by SquareOne, OTB Ventures and Onsigh…
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