英伟达在SC24超算大会上推出两款新AI硬件:H200 NVL PCIe GPU和GB200 NVL4超级芯片。H200 NVL PCIe GPU是针对约七成企业机架电力供应不足20kW且采用空气冷却环境推出的相对低功耗风冷AI计算卡,其双槽厚度,最高TDP功耗降至600W,各算力有一定下降,但HBM内存容量和带宽与H200 SXM相同,还支持双路或四路NVLink桥接器互联,且内存容量、带宽、AI推理性能、HPC应用性能等方面相较于H100 NVL有不同程度提升。GB200 NVL4超级芯片面向单服务器解决方案,聚合2个Grace CPU和4个Blackwell GPU,HBM内存池容量达1.3TB,整体功耗5.4kW,相较于上代GH200 NVL4系统,拥有更高的模拟性能、AI训练性能和AI推理性能,该芯片将于2025年下半年上市。
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