Nvidiawill be holding the GTC 2024 keynote tomorrow, and Jen-Hsun Huang is expected to announce the next-generation GPU architecture called Blackwell.
According to XpeaGPU's breaking news, the B100 GPU, which launches tomorrow, will utilize twoTSMC CoWoS-L packaging technologychipCoWoS (Chip-on-Wafer) is an advanced 2.5D packaging technology that involves stacking chips together to increase processing power while saving space and reducing power consumption.
XpeaGPU reveals that the two compute chips of the B100 GPU will be connected to eight 8-Hi HBM3e memory stacks.Total capacity of 192GB. It's worth noting that AMD already offers the same capacity of 192GB with 8 HBM3 chips on its Instinct MI300 GPU.
Looking ahead, the tipster claims that the next-gen Blackwell GPU update, codenamed B200, will utilize 12-Hi to achieve higher capacity.288GB of video memory, but did not reveal whether it was HBM3e or HBM4.
NVIDIA has previously previewed the superb performance of the B100 GPU.and is set to launch in 2024, you can expect a follow-up report on how the specific parameters perform.