Nov. 4 (Bloomberg) -- South Korea's SK Group Chairman Choi Tae-won said, according to a Reuters report today, thatNvidia CEO Jen-Hsun Huang asked SK HynixSix Months Early Availability of Next-Generation High-Bandwidth Memory Known as HBM4chip.
SK Hynix plans to Second half of 2025The first HBM4 products with 12-layer DRAM stacks will be available, with 16-layer stacked HBMs available slightly later in 2026.
SK Hynix and TSMC signed a Memorandum of Understanding (MOU) in April of this year, announcing that they would strengthen their collaboration on the base die for HBM memory.
In July of this year, it was announced that NVIDIA, TSMC and SK Hynix would form a "triangular alliance" to jointly promote next-generation technologies such as HBM4 in preparation for the AI era. In addition, the news that SK Hynix has already reached a cooperation with TSMC to jointly design and produce some of the products in the HBM4 series.Mass production is scheduled to begin in 2026.; and NVIDIA provides product design.
SK Hynix released its Q3 FY2024 (ended September 30, 2024) financial results on October 24, reporting consolidated revenues of KRW 17.5731 trillion (currently about RMB 90.835 billion), up 7% sequentially and 94% year-on-year.
On the DRAM side, Hynix is rapidly converting from its existing HBM3 to 8-layer HBM3E products.In addition, the 12-layer HBM3E product, which started mass production in September, will be available in the fourth quarter of this year as originally planned.HBM's share of total DRAM sales in the third quarter was 30%. As a result, HBM's share of total DRAM sales, which accounted for 30% in the third quarter, is expected to reach 40% in the fourth quarter of this year.